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Lenovo ThinkSystem SR650 V3 Intel Xeon Gold 6526Y 16C 2.8 GHz Processor - Server arrives as a powerful enterprise-class CPU launched in Q4'23, engineered for demanding data-center workloads and two-socket (2S) server platforms.
This Intel® Xeon® Gold 6526Y from the 5th Gen Xeon Scalable family offers 16 cores and 32 threads with a base frequency of 2.8 GHz and turbo behavior up to 3.0 GHz on four high-priority cores. With a large 37.5 MB cache and support for Intel® Turbo Boost Technology 2.0, it delivers responsive performance for mixed and latency-sensitive tasks.
The processor is built on a 7 nm process and fits the LGA 4677 (Socket E) with a TDP of 195 W. It supports octa-channel DDR5 memory at up to 5200 MHz and up to 4 TB of RAM per socket, with full ECC support to ensure data integrity in mission-critical environments.
Connectivity and I/O capabilities are robust, with up to 80 PCIe lanes supporting PCIe 5.0, three UPI links at 20 GT/s, and rich virtualization and security features including Intel® VT-x, VT-d, Intel® SGX, Intel® TDX, Intel® Boot Guard and Intel® Total Memory Encryption (multi-key).
Hardware acceleration and advanced instructions are available to accelerate AI, encryption and data streaming workloads: AVX, AVX2, AVX-512, AMX, Intel® DL Boost, Intel® Crypto Acceleration, and a Data Streaming Accelerator (DSA). The chip also includes platform resilience and manageability features such as Intel® Platform Firmware Resilience and Intel® Resource Director Technology.
This processor is well suited for database servers, virtualized infrastructure, high-performance computing, AI inference and enterprise applications that require scale, memory capacity and security. Its 2S scalability and extensive feature set make it a strong choice for consolidation and edge-to-core deployments.
Note that cooling is not included; system integrators should plan for adequate thermal solutions to operate within a Tcase of 82 °C and DTS Max of 99 °C. The package carrier is E1B and the part ships with baseline servicing.
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