HP Proliant Bl460c Gen8 E5-2667 - Server Blade

HP Proliant BL460c Gen8 E5-2667 - Server Blade delivers enterprise-class compute in a compact blade form factor, offering powerful performance for modern data centers and virtualization environments.

The Intel® Xeon® E5-2667 processor at the heart of this HP Proliant BL460c Gen8 runs at a 2.9 GHz base frequency and can boost up to 3.5 GHz, making it well suited for latency-sensitive server tasks and single-threaded bursts.

With six physical cores and 16 threads, 15 MB of L3 cache and an 8.00 GT/s system bus rate, this processor balances multi-threaded throughput and cache responsiveness for demanding workloads. The chip uses 32 nm lithography and fits the LGA 2011 (Socket R) platform.

Memory capabilities are strong: quad-channel support, compatibility with 800/1066/1333/1600 MHz DIMMs, ECC support and a maximum supported memory of up to 750 GB enable large in-memory datasets and reliable operations for virtual machines and databases. The processor supports up to 51.2 GB/s memory bandwidth.

Thermal and power characteristics are designed for rack-dense deployments: a TDP of 130 W and a maximum operating temperature of 85 °C make this a robust option for server racks, while a VID voltage range of 0.6–1.35 V and tray package simplify integration into blade systems.

Typical use cases include virtualization hosts, high-performance database nodes, compute blades for scientific modeling, and latency-sensitive enterprise applications. The BL460c Gen8 form factor lets you scale out compute capacity efficiently within HP blade chassis.

Key selling points include the E5-2667’s combination of high base/boost frequencies, 16-thread concurrency, large L3 cache, quad-channel ECC memory support and a high maximum memory ceiling—features that directly benefit virtualization density and transactional workloads.

• Intel® Xeon® E5-2667, 2.9 GHz (3.5 GHz turbo)
• 6 cores / 16 threads with 15 MB L3 cache
• Quad-channel ECC memory support up to 750 GB
• TDP 130 W and max operating temperature 85 °C
• LGA 2011 (Socket R) tray package